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4-Ampere Dual Low-Side Ultrafast MOSFET Drivers
Features
* 4A Peak Source/Sink Drive Current * Wide Operating Voltage Range: 4.5V to 35V * -40C to +125C Extended Operating Temperature Range * Logic Input Withstands Negative Swing of up to 5V * Matched Rise and Fall Times * Low Propagation Delay Time * Low, 10A Supply Current * Low Output Impedance
IXD_604
Description
The IXDD604/IXDF604/IXDI604/IXDN604 dual high-speed gate drivers are especially well suited for driving the latest IXYS MOSFETs and IGBTs. Each of the two outputs can source and sink 4A of peak current while producing voltage rise and fall times of less than 10ns. The input of each driver is virtually immune to latch up, and proprietary circuitry eliminates cross conduction and current "shoot-through." Low propagation delay and fast, matched rise and fall times make the IXDD604/IXDF604/IXDI604/ IXDN604 ideal for high-frequency and high-power applications. The IXDD604 is a dual non-inverting driver with an enable. The IXDN604 is a dual non-inverting driver, the IXDI604 is a dual inverting driver, and the IXDF604 has one inverting driver and one non-inverting driver. The IXDD604/IXDF604/IXDI604/IXDN604 family is available in a standard 8-lead DIP (PI), 8-lead SOIC (SIA), 8-lead SOIC with an exposed grounded metal back (SI), and an 8-lead DFN (D2) package.
Applications
* * * * * * Efficient Power MOSFET and IGBT Switching Switch Mode Power Supplies Motor Controls DC to DC Converters Class-D Switching Amplifiers Pulse Transformer Driver
Pb
RoHS
2002/95/EC
e3
Ordering Information
Part Number
IXDD604D2TR IXDD604PI IXDD604SI IXDD604SITR IXDD604SIA IXDD604SIATR IXDF604PI IXDF604SI IXDF604SITR IXDF604SIA IXDF604SIATR IXDI604PI IXDI604SI IXDI604SITR IXDI604SIA IXDI604SIATR IXDN604PI IXDN604SI IXDN604SITR IXDN604SIA IXDN604SIATR DS-IXD_604 - R00C
Logic Configuration
ENA INA ENB INB
Package Type
8-Lead DFN 8-Lead DIP 8-Lead SOIC with Exposed, Grounded Metal Back 8-Lead SOIC with Exposed, Grounded Metal Back 8-Lead SOIC 8-Lead SOIC 8-Lead DIP 8-Lead SOIC with Exposed, Grounded Metal Back 8-Lead SOIC with Exposed, Grounded Metal Back 8-Lead SOIC 8-Lead SOIC 8-Lead DIP 8-Lead SOIC with Exposed, Grounded Metal Back 8-Lead SOIC with Exposed, Grounded Metal Back 8-Lead SOIC 8-Lead SOIC 8-Lead DIP 8-Lead SOIC with Exposed, Grounded Metal Back 8-Lead SOIC with Exposed, Grounded Metal Back 8-Lead SOIC 8-Lead SOIC
Packing Method
Tape & Reel Tube Tube Tape & Reel Tube Tape & Reel Tube Tube Tape & Reel Tube Tape & Reel Tube Tube Tape & Reel Tube Tape & Reel Tube Tube Tape & Reel Tube Tape & Reel
Quantity
2000 50 100 2000 100 2000 50 100 2000 100 2000 50 100 2000 100 2000 50 100 2000 100 2000 1
A
OUTA
B
OUTB
INA
A
OUTA
INB
B
OUTB
INA
A
OUTA
INB
B
OUTB
INA
A
OUTA
INB
B
OUTB
PRELIMINARY
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IXD_604
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Lead Configurations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Lead Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.1 IXDD604 Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2 IXDI604 Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3 IXDF604 Functional Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.4 IXDN604 Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3. IXD_604 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3 3 3 3 3 4 5 5 6 6 6 6 6 7 7 7 8
11 11 11 11 11 12
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IXD_604
1 Specifications
1.1 Lead Configurations
IXDD604PI/SI/SIA
ENA INA GND INB 1 2 3 4 8 ENB OUTA VCC OUTB ENA INA INB ENB 1 2 3 4
1.2 Lead Definitions
IXDD604D2
8 OUTA GND VCC OUTB
Lead Name INA INB ENA
Description Channel A Logic Input Channel B Logic Input Channel A Enable Input Drive lead low to disable Channel A and force Channel A Output to a high impedance state Channel B Enable Input Drive lead low to disable Channel A and force Channel A Output to a high impedance state Channel A Output -Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT Channel B Output -Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT Supply Voltage - Provides power to the device Ground - Common ground reference for the device
A
7 6
A B
7 6 5
B
5
IXDI604PI/SI/SIA
NC INA GND INB 1 2 3 4 8 NC OUTA VCC OUTB NC INA GND INB
IXDF604PI/SI/SIA
1 2 3 4 8 NC OUTA VCC OUTB
A
7 6
A
7 6
ENB OUTA OUTA OUTB OUTB VCC GND
B
5
B
5
IXDN604PI/SI/SIA
NC INA GND INB 1 2 3 4 8 NC OUTA VCC OUTB
A
7 6
B
5
1.3 Absolute Maximum Ratings Parameter Supply Voltage All Other Leads Output Current Junction Temperature Storage Temperature TJ TSTG Symbol VCC Minimum
-0.3 -55 -65
Maximum
40 VCC+0.3 4 +150 +150
Units
V V A C C
Absolute maximum electrical ratings are at 25C
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied.
1.4 Recommended Operating Conditions Parameter Supply Voltage Operating Temperature Range Symbol VCC TA Minimum
4.5 -40
Maximum
35 +125
Units
V C
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1.5 Electrical Characteristics Test Conditions: TA=25C, 4.5V < VCC < 35V, one channel (unless otherwise noted). Parameter Input Voltage, High Input Voltage, Low Input Voltage Range Input Current High EN Input Voltage Low EN Input Voltage Output Voltage, High Output Voltage, Low Output Resistance, High State Output Resistance, Low State Output Current, Continuous Rise Time Fall Time On-Time Propagation Delay Off-Time Propagation Delay Enable to Output-High Delay Time Disable to High Impedance State Delay Time Enable Pull-Up Resistor Power Supply Current Conditions 4.5V < VCC < 18V 4.5V < VCC < 18V 0V < VIN < VCC IXDD604 only IXDD604 only VCC=18V, IOUT=-10mA VCC=18V, IOUT=10mA Limited by package power dissipation CLOAD=1000pF, VCC=18V CLOAD=1000pF, VCC=18V CLOAD=1000pF, VCC=18V CLOAD=1000pF, VCC=18V IXDD604 only IXDD604 only VCC=18V, VIN=3.5V VCC=18V, VIN=0V VCC=18V, VIN=VCC
ICC
Symbol
VIH VIL VIN IIN VENH VENL VOH VOL ROH ROL IDC tR tF tONDLY tOFFDLY tENOH tDOLD REN
Minimum
3 -5 -10 2/3VCC VCC-0.025 -
Typical
1.3 1.1 9 8 29 35 35 40 200 1 -
Maximum
0.8 VCC+0.3 10 1/3VCC 0.025 2.5 2 1 16 14 50 50 55 55 3 10 10
Units V
A V
V
A
ns
k mA A
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1.6 Electrical Characteristics Test Conditions: TA=-40C to +125C, 4.5V < VCC < 35V, TJ<150C, one channel (unless otherwise noted). Parameter Input Voltage, High Input Voltage, Low Input Voltage Range Input Current Output Voltage, High Output Voltage, Low Output Resistance, High State Output Resistance, Low State Output Current, Continuous Rise Time Fall Time On-Time Propagation Delay Off-Time Propagation Delay Enable to Output-High Delay Time Disable to High Impedance State Delay Time Power Supply Current Conditions 4.5V < VCC < 18V 4.5V < VCC < 18V 0V < VIN < VCC VCC=18V, IOUT=-10mA VCC=18V, IOUT=10mA Limited by package power dissipation CLOAD=1000pF, VCC=18V CLOAD=1000pF, VCC=18V CLOAD=1000pF, VCC=18V CLOAD=1000pF, VCC=18V IXDD604 only IXDD604 only VCC=18V, VIN=3.5V VCC=18V, VIN=0V VCC=18V, VIN=VCC
ICC
Symbol
VIH VIL VIN IIN VOH VOL ROH ROL IDC tR tF tONDLY tOFFDLY tENOH tDOLD
Minimum
3.1 -5 -10 VCC-0.025 -
Typical
1 -
Maximum
0.65 VCC+0.3 10 0.025 3 2.5 1 16 14 65 65 65 65 3.5 150 150
Units V
A V
A
ns
mA A
1.7 Thermal Characteristics Package IXDD604D2 (8-Lead DFN) IXD_604PI (8-Lead DIP) IXD_604SI (8-Lead SOIC with Exposed, Grounded Metal Back) IXD_604SIA (8-Lead SOIC) JA Parameter Rating
35 125 85 120 C/W
Units
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2 Functional Description
2.1 IXDD604 Functional Block Diagram 2.3 IXDF604 Functional Block Diagram
IXDD604
VCC 200k ENA
VCC 200k ENB VCC
IXDF604
VCC
INA
OUTA
OUTA INA
GND VCC
GND
VCC
INB
OUTB
INB OUTB
INA 0 INX 0 1 0 1 ENX 1 or open 1 or open 0 0 OUTX
0 1 Z Z
OUTA
1 0 OUTB 0 1
1 INB 0 1
2.2 IXDI604 Functional Block Diagram
2.4 IXDN604 Functional Block Diagram
IXDI604
VCC
IXDN604
VCC
INA
OUTA
INA
OUTA
GND VCC
GND VCC
INB
OUTB
INB
OUTB
INX 0 1
OUTX
1 0
INX 0 1
OUTX
0 1
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3 IXD_604 Performance
3.1 Timing Diagrams
VIH INx VIL tOFFDELAY 90% 10% tF tR tR tF tONDELAY 90% OUTx OUTx 10% INx VIH VIL tONDELAY tOFFDELAY
3.2 Characteristics Test Diagram
ENA
+
ENB OUTA VCC CLOAD OUTB Tektronix Current Probe 6302
0.1F
10F
VCC -
INA GND VIN INB
CLOAD
Tektronix Current Probe 6302
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3.3 Typical Performance Characteristics
A&B Rise Times vs. VCC for Various Load Capacitances (Input=0-5V, f=10kHz, TA=25C) A&B Fall Times vs. VCC for Various Load Capacitances (Input=0-5V, f=10kHz, TA=25C)
120 100
120 100 80 60 40 20 0
120 100 Rise Time (ns) 80 60 40 20 0
A&B Rise Time vs. Load Capacitance at Various VCC Levels
VCC=4.5V VCC=8V VCC=12V VCC=18V VCC=24V VCC=35V
Rise Time (ns)
80 60 40 20 0 0 5 10 15 20 25 VCC (V) 30 35 40 CL=10nF CL=1nF CL=470pF
Fall Time (ns)
CL=10nF CL=1nF CL=470pF
0
5
10
15
20 25 VCC (V)
30
35
40
0
2000
4000 6000 8000 Load Capacitance (pF)
10000
120 100 Fall Time (ns) 80 60 40 20 0
A&B Fall Time vs. Load Capacitance at Various VCC Levels
Rise & Fall Times (ns) VCC=4.5V VCC=8V VCC=12V VCC=18V VCC=24V VCC=35V
10 9 8
A&B Rise and Fall Times vs. Temperature (Input=0-5V, CL=1nF, VCC=18V)
Input Threshold Voltage (V)
2.9 2.7 2.5
Input Threshold Voltage vs. Temperature (CL=1nF, VCC=18V)
tR tF
Min VIH 2.3 2.1 Max VIL 1.9 1.7
7 6 5 4
0
2000 4000 6000 8000 Load Capacitance (pF)
10000
-40 -20
0
20 40 60 80 Temperature (C)
100 120 140
-40 -20
0
20 40 60 80 Temperature (C)
100 120 140
350 Supply Current (mA) 300 250 200 150 100 50
Supply Current vs. Load Capacitance Both Outputs Active (VCC=8V)
f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz
1000 Supply Current (mA) 100 10 1 0.1 0.01
Supply Current vs. Frequency Both Outputs Active (VCC=8V)
Supply Current (mA) CL=10nF CL=1nF CL=470pF
400 350 300 250 200 150 100 50
Supply Current vs. Load Capacitance Both Outputs Active (VCC=12V)
f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz
0 100
1000 Load Capacitance (pF)
10000
1
10
100 1000 Frequency (kHz)
10000
0 100
1000 Load Capacitance (pF)
10000
1000 Supply Current (mA) 100 10 1 0.1 0.01 1
Supply Current vs. Frequency Both Outputs Active (VCC=12V)
Supply Current (mA) CL=10nF CL=1nF CL=470pF
400 350 300 250 200 150 100 50
Supply Current vs. Load Capacitance Both Outputs Active (VCC=18V)
f=1MHz f=500kHz f=100kHz f=50kHz f=2MHz
1000
Supply Current (mA)
Supply Current vs. Frequency Both Outputs Active (VCC=18V)
CL=10nF CL=1nF CL=470pF
100
10
1
10 100 Frequency (kHz)
1000
0 100
0.1
1000 Load Capacitance (pF) 10000
1
10
100 1000 Frequency (kHz)
10000
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1000
Supply Current vs. Load Capacitance Both Outputs Active (VCC=35V)
f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz
1000
Supply Current vs. Frequency Both Outputs Active (VCC=35V)
Propagation Delay (ns)
160 140 120 100 80 60 40 20
Propagation Delay vs. Supply Voltage (CL=1nF, Input=0-5V, f=1kHz)
Supply Current (mA)
Supply Current (mA)
100
100
CL=10nF CL=1nF CL=470pF
10
10
tOFFDLY
tONDLY 0 5 10 15 20 25 Supply Voltage (V) 30 35
1 100
1 1000 Load Capacitance (pF) 10000 1 10 100 1000 Frequency (kHz) 10000
70 Propagation Delay (ns) 60 50 40
Propagation Delay vs. Input Voltage (CL=1nF, VCC=15V)
Propagation Delay (ns)
Propagation Delay vs. Temperature
50 Supply Current (mA) 45 40 35 30 25 20 tONDLY tOFFDLY 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -40 -20 0 20 40 60 80 Temperature (C) 100 120 140
Dynamic Supply Current vs. Temperature (VCC=18V, VIN=5V, f=1khz, CL=1nF)
tOFFDLY 30 tONDLY 20 2 4 6 8 Input Voltage (V) 10 12
-40 -20
0
20 40 60 80 Temperature (C)
100 120 140
3.0
Quiesent Supply Current vs. Temperature (VCC=18V)
VIN=3.5V VIN=5V VIN=10V
High State Output Resistance @-10mA vs. Supply Voltage
4.0 3.5 Resistance ()
Resistance () 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0
Low State Output Resistance @+10mA vs. Supply Voltage
Supply Current (mA)
2.5 2.0 1.5 1.0 0.5
3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 5 10 15 20 25 Supply Voltage (V) 30 35
VIN=0V & 18V 0.0 -40 -20 0 20 40 60 80 Temperature (C) 100 120 140
0
5
10 15 20 25 Supply Voltage (V)
30
35
0 Output Source Current (A) -2 -4 -6 -8 -10 0 5
Output Source Current vs. Supply Voltage (CL=10nF)
Output Sink Current (A)
10 8 6 4 2 0
Output Sink Current vs. Supply Voltage (CL=10nF)
Output Source Current (A)
6
Output Source Current vs. Temperature (VCC=18V, CL=10nF)
5
4
3
2
10 15 20 25 Supply Voltage (V)
30
35
0
5
10 15 20 25 Supply Voltage (V)
30
35
-40 -20
0
20 40 60 80 Temperature (C)
100 120 140
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6.0 Output Sink Current (A)
Output Sink Current vs. Temperature (VCC=18V, CL=10nF)
Enable Threshold (V)
Enable Threshold vs. Supply Voltage
22 20 18 16 14 12 10 8 6 4 2 0 0 5 10 15 20 25 Supply Voltage (V)
Input Threshold vs. Supply Voltage
3.2 Input Threshold (V) 3.0
VENH VENL
5.0
2.8 2.6 2.4 2.2 2.0 1.8 1.6 1.4 VIH VIL
4.0
3.0
2.0 -40 -20 0 20 40 60 80 Temperature (C) 100 120 140
30
35
0
5
10 15 20 25 Supply Voltage (V)
30
35
10
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4 Manufacturing Information
4.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device IXDD604D2 IXD_604PI/SI/SIA Moisture Sensitivity Level (MSL) Rating MSL 3 MSL 1
4.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
4.3 Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed.
Device IXD_604SI/SIA/D2 IXD_604PI Maximum Temperature x Time 260C for 30 seconds 250C for 30 seconds
4.4 Board Wash Clare recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since Clare employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used.
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2002/95/EC
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4.5 Mechanical Dimensions 4.5.1 IXD_604SIA (8-Lead SOIC)
0.10 / 0.25 (0.004 / 0.010) 1.27 (0.050)
5.80 / 6.20 (0.228 / 0.244)
3.80 / 4.00 (0.150 / 0.157)
0.40 / 1.27 (0.016 / 0.050)
5.40 (0.213)
1.55 (0.061)
PIN 1 0.31 / 0.51 (0.012 / 0.020) 4.80 / 5.00 (0.190 / 0.197) 0.10 / 0.25 (0.004 / 0.010) 1.30 / 1.75 (0.051 / 0.069) 1.27 BSC (0.05 BSC) 0.25 / 0.50 x45 (0.010 / 0.020 x45) 0.60 (0.024)
0 / 8
Recommended PCB Land Pattern
Dimensions mm MIN / mm MAX (inches MIN / inches MAX) NOTE: Molded package conforms to JEDEC standard configuration MS-012 variation AA.
4.5.2 IXD_604SI (8-Lead SOIC with Exposed, Grounded Metal Back)
0.10 / 0.25 (0.004 / 0.010) 3.80 (0.150)
5.80 / 6.20 (0.228 / 0.244)
3.80 / 4.00 (0.150 / 0.157)
0.40 / 1.27 (0.016 / 0.050)
2.75 5.40 (0.209) (0.108)
1.55 (0.061)
PIN 1 0.31 / 0.51 (0.012 / 0.020) 4.80 / 5.00 (0.190 / 0.197) 0.03 / 0.10 (0.001 / 0.004) 1.30 / 1.75 (0.051 / 0.069) Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 2.29 / 2.79 (0.090 / 0.110) 1.27 BSC (0.05 BSC) 0.25 / 0.50 x45 (0.010 / 0.020 x45) 1.27 (0.050) 0.60 (0.024)
0 / 8
Recommended PCB Land Pattern
3.30 / 3.81 (0.130 / 0.150)
NOTE: Molded package conforms to JEDEC standard configuration MS-012 variation BA.
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PRELIMINARY
R00C
www..com
IXD_604
4.5.3 IXDD604D2 (8-Lead DFN)
5.00 BSC (0.197 BSC) Pin 1 4.00 BSC (0.158 BSC) 0.80 / 1.00 (0.031 / 0.039) 0.20 REF (0.008 REF) 0.35 x 45 (0.014 x 45) 0.95 (0.037) 4.50 (0.177)
0.45 (0.018)
3.05 (0.120)
0.00 / 0.05 (0.000 / 0.002) 0.76 / 0.81 (0.030 / 0.032)
1.20 (0.047)
2.55 (0.100)
Recommended PCB Land Pattern
3.04 / 3.09 (0.120 / 0.122) 0.95 BSC (0.037 BSC) Pin 1 0.35 / 0.45 x 45 (0.014 / 0.018 x 45) 0.30 / 0.45 (0.012 / 0.018) Pin 8 2.54 / 2.59 (0.100 / 0.102) Dimensions mm MIN / mm MAX (inches MIN / inches MAX)
4.5.4 IXD_604PI (8-Lead DIP)
9.02 / 10.16 (0.355 / 0.400) 0.20 / 0.38 (0.008 / 0.015) 8-0.900 DIA. (8-0.035 DIA.) 2.540 (0.100)
6.10 / 6.86 (0.240 / 0.270)
7.62 BSC (0.300 BSC)
1.40 (0.055)
7.50 (0.295)
2.540 BSC (0.100 BSC) 3.05 / 3.81 (0.120 / 0.150)
7.37 / 8.26 (0.290 / 0.325)
7.62 / 10.92 (0.300 / 0.430)
PC Board Pattern
0.38 / 1.02 (0.015 / 0.040)
3.43 / 4.70 (0.135 / 0.185) Dimensions mm MIN / mm MAX (inches MIN / inches MAX)
1.14 / 1.65 (0.045 / 0.065) 0.38 / 0.58 (0.015 / 0.023)
3.18 / 3.81 (0.125 / 0.150) NOTE: Molded package conforms to JEDEC standard configuration MS-001 variation BA.
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare's Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-IXD_604-R00C (c)Copyright 2010, Clare, Inc. All rights reserved. Printed in USA. 7/19/2010
R00C
PRELIMINARY
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